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Ubee Selects Ikanos for Its Next-Generation Multi-Mode Gateway Products




FREMONT, CA — (Marketwired) — 12/03/14 — . (NASDAQ: IKAN), a leading provider of advanced broadband semiconductor and software products for the connected home, today announced that it has extended its partnership with Ubee Interactive, a global provider of broadband connectivity products and solutions, to develop next-generation CPE products for deployment by global carriers. Building on Ubee–s existing installed base of Ikanos-based triple-play gateways in Europe, the company plans to integrate Ikanos– latest Vx500 family of gateway processors into its next-generation xDSL and multi-mode home gateways to meet the needs of global carriers. This platform strategy will enable Ubee to address the growing demand for vectoring-capable VDSL gateways in the market, with a seamless software migration path to gigabit broadband.

The new Fusiv Vx585 gateway processor from Ikanos will power Ubee–s next-generation gateway platform, providing support for the full suite of ADSL and VDSL connectivity, including vectoring and bonding. The high-performance acceleration engines embedded in the Vx500 family enable reliable and secure, gigabit WiFi performance, dual-band concurrent 802.11n and 802.11ac, as well as line-rate routing capabilities, with minimal impact on the main processor subsystem. With a dual-core CPU architecture running up to 1.2Ghz, and support for multi-threading, Vx500 processor cores appear as four individual virtual cores to the operating system, creating an efficient, powerful, and developer-friendly software environment. The high-performance USB3.0 and SATA interfaces are ideal for high-speed storage, cloud caching, and simultaneous LTE connectivity at up to Category 7 speeds.

“Ubee–s history of collaboration with Ikanos has already resulted in bringing full-featured, high-performance home gateways to market,” said Gilles Guittard, VP EMEA, Ubee Interactive. “Ubee and Ikanos share a common vision of bringing innovative gateway platforms to carriers and their subscribers – built on an architecture that will ensure a smooth software migration path to gigabit broadband services.”

The partnership also provides carriers a broadband migration path for serving existing subscribers while expanding their installed bases. Ikanos Fusiv family chipsets, from the widely deployed Vx100 family to today–s breakthrough Vx500 processors, are built on a common architecture and design, making Fusiv the foundation for G.fast gigabit gateways as they are introduced. Ikanos– unified architecture ensures that software investments by gateway OEMs and carriers will be completely reusable as they migrate from VDSL to G.fast.

Further accentuating Ikanos– leadership in consumer broadband, the company in 2013 introduced the industry–s first on-chip, software-based diagnostics for xDSL home gateways. The inSIGHT BXM Broadband eXperience Manager, an expert-system application that resides on the home gateway, provides the carrier with real-time information on how to improve the subscriber–s quality of service. inSIGHT is available on all Fusiv Vx500 family chipsets, enabling Ubee to increase its competitive edge in delivering full-featured CPE devices to its carrier customers as the company expands its global base.

“We–re very excited to extend our partnership with Ubee Interactive, which continues to bring leading-edge broadband products to the market at a time of unprecedented demand,” said Kourosh Amiri, vice president of marketing at Ikanos. “Ubee and Ikanos have a proven track record of collaboration and deployment, resulting from a mutual desire to bring highly differentiated products to carriers and their subscribers. We look forward to extending this partnership to address new markets and new geos, and to offer global carriers a common roadmap to gigabit broadband.”

Ubee is a global broadband technology company providing residential and commercial wireline and wireless solutions to service providers around the world. The company develops and delivers innovative digital devices to leading operators of converged communication services through its strengths in R&D, design, manufacturing management and engineering. Specifically, Ubee is a leading player in the Broadband CPE market delivering Cable, DSL, Fiber and Mobile gateways and routers with over 50 million units deployed worldwide. Ubee has offices in Europe: Amsterdam, Asia: Hsinchu, Taiwan, and The Americas: Englewood, Colorado (USA). For more information, visit .

Ikanos Communications, Inc. (NASDAQ: IKAN) is a leading provider of advanced broadband semiconductor and software products for the connected home. The company–s broadband DSL, communications processors and other offerings power access infrastructure and customer premises equipment for many of the world–s leading network equipment manufacturers and telecommunications service providers. For more information, visit .

© 2014 Ikanos Communications, Inc. All Rights Reserved. Ikanos Communications, Ikanos and the Ikanos logo, the Bandwidth without Boundaries tagline, Fusiv, inSIGHT BXM, Ikanos Velocity and Ikanos NodeScale are among the trademarks or registered trademarks of Ikanos Communications. All other trademarks mentioned herein are properties of their respective holders.

Some of the statements included in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. You should not place undue reliance on these statements. These forward-looking statements may be identified by the words “expect,” “intend,” “plan,” “believe,” “anticipate,” “estimate,” and similar expressions, and include statements that reflect the current views of our senior management with respect to future events with respect to our business and our industry in general, as well as statements regarding the anticipated deployment of our products.

Forward-looking statements address matters that involve risks and uncertainties. Accordingly, there are or will be important factors that could cause our actual results to differ materially from those indicated in these statements. We believe that these factors include, but are not limited to, whether our products, as incorporated into end products, will meet the needs of global carriers; whether the deployment of our chipsets will occur at the rate anticipated, or at all; whether the expected software migration benefits will be realized by our customers to the extent anticipated, or at all; whether the products utilizing our chipset will be successful in the marketplace at the level anticipated, or at all; market acceptance of our products; timely transition to new products; whether new designs and design wins will result in sales of our products at the levels anticipated, or at all; that the delays in new customer product ramps will continue for longer than anticipated; that the rate of acceptance of our new and future products by our customers and telecommunications service providers may be lower than anticipated; our ability to complete future products when anticipated or at all; macroeconomic or other conditions which may cause our customers to defer purchasing plans or cancel any purchasing plans altogether despite successful design wins or successful field trials; the continued demand by telecommunications service providers for our specific xDSL semiconductor products; the failure of telecommunications service providers to implement deployment plans on schedule, or at all, despite increased performance results; our ability to generate demand and close transactions for the sale of our products; competition in the markets in which we operate; and the fact that the products we sell may not satisfy shifting customer demand or compete successfully with our competitors– products. For a more detailed discussion of how these and other risks and uncertainties could cause our actual results to differ materially from those indicated in our forward-looking statements, see our reports filed with SEC (available at ), including our Quarterly Report on Form 10-Q for the quarter ended September 28, 2014 filed on November 10, 2014.





Posted by on 3. December 2014. Filed under Picture Gallery, Semiconductors. You can follow any responses to this entry through the RSS 2.0. You can leave a response or trackback to this entry

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