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HUBER+SUHNER showcases superior aerospace solutions at SpaceCom2017




Herisau, 29 November 2017: Global leader in space, defense and aviation connectivity, HUBER+SUHNER, is set to showcase its extensive aerospace solution portfolio for the first time at SpaceCom2017 in Houston, Texas next week.

As the nation’s top conference for space technologies and new business opportunities, SpaceCom brings together over 250 NASA executives and businesses to discuss new space technologies and assets.

“We are currently in a unique position, with the ability to forecast opportunities to offer just-in-time product innovations to keep pace with the expanding capabilities of modern RF technology,” said Roman Buff, Market Manager of Aerospace at HUBER+SUHNER.

Continuing to build upon decades of spaceflight heritage, the company is staying ahead of the curve by working with industry leaders to develop high-speed digital communication solutions that meet the demands of the future.

Products on display at the HUBER+SUHNER booth (#421) include: the SUCOFLEX 300 series; the solderless bend-to-the-end minibend family; the phase invariant foam extruded CT line; the ganged SMPM based SERDES solutions; and a number of RF over Fiber and all optical switching technologies.

“When pushing the limits of next-generation bandwidth and high-capacity, high-density systems are mission critical, and HUBER+SUHNER has the proven capability to meet and exceed the industry’s expectations of high-speed digital interconnections within the most challenging operating environments,” added Buff.

Representatives from HUBER+SUHNER Astrolab Inc., New Jersey – which was designated as the Corporate Space Flight Center of Excellence in 2015 – will be on-site at SpaceCom2017 to meet with customers and discuss new product developments.

SpaceCom visitors can view HUBER+SUHNER’s latest product offerings at Booth 421 between December 5-7 at the George R Brown Convention Centre, Houston, TX.





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