Home » Electronics & Semiconductors » International Conference on the Application and Use of Copper Materials: \”Copper Alloys 2018\” presents powerful conference program

International Conference on the Application and Use of Copper Materials: \”Copper Alloys 2018\” presents powerful conference program

In cooperation with the Swedish institute Swerea KIMAB, the German Copper Institute is organizing for the first time in Milan on April 11 and 12, 2018 an international congress for copper processing companies, universities and research institutes, which will present the latest scientific and technical developments regarding the use of copper materials. Interested parties can register for the event until March 11th.

In addition to aspects such as the growing requirements in automobile technology, in electrical and electronic applications, the focus is on processing and production, recycling, material design and corrosion properties of copper materials as well as traditional topics such as copper materials in drinking water systems. The conference provides a comprehensive overview of challenges and developments in the copper industry. Various workshops also provide a platform for an active exchange between participants and experts. Overarching topics include items like \”copper materials and corrosion\”, \”processing, machining and recycling\”, \”material properties and applications\” and \”material development and characterization\”.

Well-known experts such as Lorenzo Omodei of CEN / TC 133, Italy, Inger Odnevall Wallinder of the KTH, Sweden, Frank Mücklich of the University of Saarbrücken in Germany, Paolo Piccardo of the University of Genua, Italy, and well-respected institutes e.g. Fraunhofer Germany or the Hellenic Research Center for Metals present their latest research results on copper materials as well as practical application examples.

Application-specific exchange of expertise

It is planned to position \”Copper Alloys\” as an extended platform that will enable the entire copper-related industrial and research landscape to be used every two years for application-oriented exchange of expertise at international level, thus helping to shape the future of the technological world.

The integrated industry exhibition also provides a forum for copper companies to present their service portfolio at the conference. Congress sponsorships are also available.

The registration fee for participants is 730 Euro; Students pay 250 euros. The fee for accompanying persons is also 250 euros (no participation in the congress). Participant registration for these awards will end on March 11, 2018. Thereafter, an additional 20 percent fee will be charged. The fee includes participation in the congress and the supporting program.

The detailed conference program as well as information on registration and the exhibition can be found on the website www.copperalloys.org.

With its qualified material and industry knowledge, the Kupferinstitut is competence center and network platform for generation, management and transfer of knowledge on copper and copper alloys, which is relevant to market design and market development. For several years now, the German Copper Institute has gradually expanded its more than 90-year role as a neutral consulting institute and now also offers seminars and conferences on materials-related and relevant topics at German and European level. In addition, the expansion of his laboratory has expanded the possibilities of his own examinations and thereby expanded the range of engineering services.

In addition to the long-lasting classical, technically and scientifically oriented association, the institute has developed a modern service provider that links all actors in the value chain: engineering services for the optimization of product and production, analysis and complex material and component investigations as well as a broader range of educational offers. Following that, the Kupferinstitut will continue to systematically expand its strong position as a technological competence center for copper.

Posted by on 27. February 2018. Filed under Electronics & Semiconductors. You can follow any responses to this entry through the RSS 2.0. You can leave a response or trackback to this entry

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