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UltraSoC appoints new VP of Global Sales as demand surges for embedded analytics solutions


CAMBRIDGE, UK – 15 January 2019 – UltraSoC, the leading provider of embedded analytics technology, today announced the appointment of semiconductor specialist John Hartley as Vice President of Global Sales. Hartley was selected for this senior management role due to his strong and proven team leadership skills, significant high-level track record including complex multi-cultural negotiations, and his success in building global markets.

Hartley will be responsible for driving global sales of UltraSoC?s embedded analytics and monitoring solutions to boost security and functional safety in demanding applications such as automotive, enterprise IT, artificial intelligence and machine learning.

He brings over 25 years of very relevant and global experience in the semiconductor industry to UltraSoC, having held senior sales positions in Europe, Asia and the Americas, at companies such as Microchip, Tundra Semiconductor (now IDT) and PLX (now Broadcom). Most recently, Hartley was Vice President, Global Sales at Irystec, a perceptual display software company.

Rupert Baines, UltraSoC CEO, commented: ?John joins our team at a critical phase of growth for UltraSoC, as more and more customers begin to use our embedded analytics technology to create competitive advantage ? both for themselves and their own customers. John knows the semiconductor industry ? and just as importantly, he understands our customers? needs and the pressures they are under to succeed in their markets. John brings significant value to our sales effort and along with the entire company I am excited to welcome him on board.?

John Hartley commented, ?I?m truly excited to be involved in this new world of embedded analytics which I believe will become a ubiquitous technology in the semiconductor industry in the next five years. With the product offering and vision already in place at UltraSoC and the growing need for increased intelligence and insights to be designed into so many applications, we are positioned for tremendous growth.?

Posted by on 15. January 2019. Filed under Picture Gallery, Telecommunication. You can follow any responses to this entry through the RSS 2.0. You can leave a response or trackback to this entry

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