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NXP Unveils LPC11A00 Microcontrollers With Flexible Analog Subsystem

EINDHOVEN, THE NETHERLANDS and SAN JOSE, CA — (Marketwire) — 03/27/12 — NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the featuring a fully interconnected and flexible analog subsystem, based on the ARMĀ® Cortex-M0 processor. Combining 50-MHz CPU performance with advanced analog features including Undervoltage Lockout (UVLO) in a 2.5 x 2.5-mm WLCSP package, the LPC11A00 is an ideal replacement for 8/16-bit microcontrollers in a variety of power management applications, which present significant challenges in terms of overall system performance, space constraints, and harsh environments. Fully integrated with an on-chip temperature sensor and up to 4 KB of EEPROM, the LPC11A00 microcontroller is well-suited for uninterrupted power supplies (UPS), power inverters, intelligent battery chargers, power factor correction, sensors, lighting, and power-conversion applications.

“The introduction of the LPC11A00 series shows our continued commitment to push the limits for flexible analog integration,” said Jan Jaap Bezemer, director of marketing, microcontroller business line, NXP Semiconductors. “NXP offers the most comprehensive Cortex-M0 microcontroller portfolio in the industry, supporting analog, USB, CAN, segment LCD, and dual-supply solutions.”

The integrated UVLO feature eliminates the need for external components and allows the microcontroller to remain in a safe system state whenever the supply voltage level is below the minimum valid operating level of 2.4V. This feature supports various kinds of power supply ramps including cold power-up, power droop, and power-down ramps, making the LPC11A00 extremely useful in power control and monitoring applications.

“Vicor-s VI Chips have set standards for power density, efficiency and speed,” said Dave Brush, director of strategic sourcing, Vicor. “The LPC11A00 allowed us to easily migrate from our previous 8-bit solution while adding more performance, lowering power consumption and reducing board space. Its UVLO functionality enabled us to provide the robust start-up that our customers demand, making the LPC11A00 the ideal microcontroller for our applications.”

The analog subsystem in the LPC11A00 microcontroller includes UVLO protection against power-supply drops below 2.4V; on-chip comparator with programmable voltage reference; 10-bit ADC with input multiplexing among 8 pins; 10-bit DAC with flexible conversion triggering; an integrated temperature sensor; and a highly accurate 0.9 voltage reference which can be used for internal ADC calibration. By providing seamless integration of the various analog blocks, the LPC11A00 allows system designers to off-load critical tasks from the CPU.

The interconnected subsystem offers flexible operation allowing the comparator to trigger ADC and DAC operations while taking timestamps from a 32-bit or a 16-bit timer. Conversely, these analog operations can also be triggered by the timers. For efficient system monitoring, the comparator and the timers can be further configured to make time measurements of fluctuating analog signals.

Ideal for small form factor power applications, the 20-pin WLCSP 2.5 x 2.5-mm package enables debugging/programming via the I2C-bus — a unique feature which minimizes the number of pins for system integration while simplifying board layout. On-chip ROM-based routines for the I2C interface enable seamless integration via an easy-to-use API-driven interface. The LPC11A00 WLCSP20 pin-out offers two memory configurations (16 KB and 32 KB) with up to 4 KB EEPROM, while supporting all peripherals including USART, SSP and 18 GPIOs.

Speeds of up to 50 MHz

Up to 32 KB Flash, 8 KB SRAM, 4 KB EEPROM

Includes ROM-based 32-bit integer division and I2C-bus driver routines

Up to 16 pins configurable with a digital input glitch filter for removing glitches with widths of 10 ns or less; two pins configurable for 50 ns glitch filters

USART, 1-2 SSP, I2C (Fm+) as serial peripherals

Two 16-bit and two 32-bit timers with PWM/Match/Capture

12 MHz internal RC oscillator with 1 percent accuracy over temperature and voltage

Programmable Windowed Watchdog Timer (WWDT) with a dedicated, internal low-power Watchdog Oscillator (WDOsc)

Power-On-Reset (POR); multi-level Brown-Out-Detect (BOD); Phase-Locked Loop (PLL)

Up to 42 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down resistors, repeater mode, and open-drain mode

NXP is showcasing the LPC11A00 this week at ESC Silicon Valley 2012, a DESIGN West Summit, in booth 1308. The LPC11A00 series is currently sampling to lead customers and will be available for volume production in early Q2 2012. The NXP LPC11A00 will be one of the Cortex-M0 microcontrollers covered under NXP-s new Product Longevity Program for microcontrollers, which was also announced today.

In addition to the WLCSP, the LPC11A00 will also be available in the 33-pin HVQFN and 48-pin LQFP packages. Recommended distribution unit pricing for LPC11A11FHN33/001 in 10,000 piece quantities for the HVQFN33 package is at US $1.28 with 8 KB Flash, 2 KB SRAM and 512 B EEPROM. Further information is available at:

NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting .

This document includes forward-looking statements which include statements regarding NXP-s business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP-s products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP-s relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers- equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP-s business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP-s market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, or from the SEC website, .

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