WASHINGTON, DC — (Marketwired) — 12/02/13 — , a leading supplier of virtual fabrication software to accelerate the development of new manufacturing processes, will host an expert roundtable discussion at the 2013 edition of (December 7-11, 2013. Washington, DC). The discussion will provide an in-depth and comprehensive view of the current and next generation of challenges facing IC designers and manufacturers as process technologies head to unprecedented levels of complexity, cost and technical difficulty.
Participants in the roundtable will include:
Dr. Brian Green, Senor Engineer/FEOL Architect: IBM
Mark Fisher, Senior Research Engineer: Micron
Dr. Andy Wei, Principle Member of Technical Staff – 10nm: GLOBALFOUNDRIES
Jaouen Herve, Director, Modeling & Simulation: ST Microelectronics
Sean Lian, Director/Technology Lead: Samsung
Laith Altimime, Director CMOS Technology & Design: IMEC
David Fried, CTO-Semiconductor: Coventor, Inc.
Panelists will examine the changing business dynamics and most pressing technical issues faced by the world-s leading IC companies. Topics to be covered include: FinFETS, 3D ICs, Flash memory, double patterning, advance modeling and simulation techniques, process variation challenges, and accelerating yield ramps.
: Kalorama Ballroom
The hotel is right across the street from the Washington Hilton where IEDM is held.
Doors open at and the discussion begins at
Cocktail and hors d-oeuvres to be served
Coventor, Inc. is the market leader in automated design solutions for micro-electromechanical systems (MEMS) and virtual fabrication of MEMS and semiconductor devices. More information is available at .
For more information, contact:
Mike Sottak
(408) 876-4418
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