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Acacia Communications Introduces CFP2-ACO Module Based on Its Silicon PIC

MAYNARD, MA — (Marketwired) — 03/22/16 — , a leading provider of high-speed coherent optical interconnect products, today announced that its has started sampling modules based on the CFP2-ACO Implementation Agreement defined by the Optical Internetworking Forum (OIF). Acacia–s CFP2-ACO modules contain optical components necessary for dual polarization coherent transmission and utilize an analog RF interface to a coherent Digital Signal Processor (DSP) that resides on the host board. Acacia–s CFP2-ACO module will work with other DSPs in the market including Acacia–s DSP.

Acacia–s CFP2-ACO is capable of supporting both 100G DP-QPSK and 200G DP-16QAM modulation, at a power consumption rate which is below the 12W set forth in the OIF Implementation Agreement guidelines.

Acacia–s CFP2-ACO module is the fourth Acacia product family to utilize its integrated coherent silicon PIC. Acacia has been shipping silicon PICs in volume since November 2014 in its AC100-CFP product family and also in its 400G AC400 flex product family.

“We believe we can efficiently ramp the CFP2-ACO through the utilization of the same silicon PIC technology that is currently shipping in volume on two other Acacia products,” said Acacia–s President and CEO Raj Shanmugaraj. “The CFP2-ACO has been adopted by some system vendors who have their own in-house DSP technology and we believe that Acacia–s CFP2-ACO module addresses this new portion of the coherent market.”

Acacia plans to demonstrate its CFP2-ACO module during the Optical Fiber Conference (OFC) at the Anaheim Convention Center, March 22-24, 2016.

Acacia Communications develops, manufactures and sells high-speed coherent optical interconnect products that are designed to transform communications networks through improvements in performance, capacity and cost. By converting optical interconnect technology to a silicon-based technology, a process Acacia refers to as the “siliconization of optical interconnect,” Acacia is able to offer products that meet the needs of cloud and service provider customers in a simple, open, high-performance form factor that can be easily integrated in a cost-effective manner with existing network equipment.

Media Contact:

Jason Ouellette


Posted by on 22. March 2016. Filed under Electronic Components, Picture Gallery. You can follow any responses to this entry through the RSS 2.0. You can leave a response or trackback to this entry

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