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Zarlink Presenting Technical Paper on IEEE 1588 Timing Solutions at Freescale Technology Forum-China

OTTAWA, CANADA — (Marketwire) — 08/30/11 — Zarlink Semiconductor (TSX: ZL) today announced that system architect Peter Meyer will be presenting a technical paper on IEEE 1588 solutions for wireless backhaul applications at the Freescale Technology Forum – China (Wednesday, August 31 at 4:15 p.m. in the Yuan Room).

The presentation will discuss the evolution of packet network synchronization, industry standards, and the benefits of using Zarlink-s recently released IEEE 1588 enabled Synchronous Ethernet (SyncE) devices with Freescale-s processors that have embedded time stamp capabilities. Zarlink-s scalable single-chip IEEE 1588 enabled SyncE phase locked loop (PLL) devices integrate low bandwidth PLLs with very low jitter synthesizers, enabling the seamless use of SyncE and IEEE 1588 while at the same time supporting external time stamping functionality. For production information visit .

“We are seeing tremendous growth in deployments of wireless infrastructure in China, continuing now with new technologies such as LTE,” said Jeremy Lewis, Product Line Manager with Zarlink-s Timing and Synchronization product group. “Synchronization is a key technology for packet infrastructures now being deployed to handle the ever increasing Radio Access Network traffic load. Zarlink-s IEEE 1588 Synchronization solution, coupled with Freescale-s Time Stamp engines, provides a complete, cost-effective platform for customer designs.”

Zarlink will be showcasing its comprehensive portfolio of timing and voice solutions for packet networks at the Freescale Technology Forum – China Technology Lab, including:

About Zarlink Semiconductor

Zarlink Semiconductor delivers world-leading, mixed-signal chip technologies for a broad range of communication and medical applications. The Company-s core capabilities include timing solutions that manage time-sensitive communication applications over wireless and wired networks, line circuits supporting high-quality voice services over cable and broadband connections, and ultra low-power radios enabling new wireless medical devices and therapies. Serving the world-s largest original equipment manufacturers, Zarlink-s highly integrated chip solutions help customers simplify design, lower costs and reach market quickly. For more information, visit .

Shareholders and other individuals wishing to receive, free of charge, copies of the reports filed with the U.S. Securities and Exchange Commission and Canadian Securities Regulatory Authorities, should visit the Company-s web site at or contact Investor Relations.

Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 and the applicable regulations of the Canadian Securities Administrators. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the following: our dependence on the successful development and market introduction of new products; our ability to integrate any business, technologies, product lines or services that we have or will acquire; our dependence on revenue generation from our legacy products in order to fund development of our new products; current market conditions, including the lack of liquidity in the markets and economic slowdown, may increase our operating costs or reduce our revenue, thereby negatively impacting our operating results; our ability to operate profitably and generate positive cash flows in the future; significant fluctuations in foreign exchange rates may adversely impact our results of operations; our dependence on our foundry suppliers and third-party subcontractors; order cancellations and deferrals by our customers; our substantial indebtedness could adversely affect our financial position; the cost and accounting implications of compliance with new accounting standards; and other factors referenced in our Annual Report on Form 20-F. Investors are encouraged to consider the risks detailed in this filing.

Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.

Contacts:
Ed Goffin
Media Relations and Investor Relations
613 270-7112

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