Siemens Finance Week: Driving investments to overcome Asia–s infrastructure gap

.
Siemens outlines innovative ways and approaches to boost large-scale capital in infrastructure financing
Convergence of disruptive technology and public-private partnerships identified as key drivers of narrowing Asia?s infrastructure gap
The way forward lies in analyzing completed projects, establishing stable risk-sharing and making procurement more transparent
Increasing the bankability of developments is a key factor to narrowing Asia?s infrastructure gap,

QuickLogic Signs Agreement with Second Top-Tier Foundry for ArcticPro(TM) eFPGA IP

QuickLogic Signs Agreement with Second Top-Tier Foundry for ArcticPro(TM) eFPGA IP

SUNNYVALE, CA — (Marketwired) — 02/14/17 — QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power programmable sensor processing, embedded FPGA IP, display bridge and programmable logic solutions, today announced that it has signed an agreement with a second top-tier foundry to port, and market for licensing, the company–s embedded FPGA (eFPGA) technology. This agreement expands the availability of QuickLogic–s ArcticPro eFPGA IP to semiconductor companies and OEMs that are