Lattice Semiconductor Will Showcase New Reference Design for MIPI CSI-2 Image Sensor Bridge at CES 2013

"Mobile Innovation" Reference Design Enables Image Sensors to Be Used in a Variety of Consumer Applications

"Mobile Innovation" Reference Design Enables Image Sensors to Be Used in a Variety of Consumer Applications

New Vision and Strategy; Focus on Five Growth Drivers Decision to Exit ST-Ericsson After a Transition Period New Financial Model Targeting 10 Percent or More Operating Margin
SEOUL, SOUTH KOREA — (Marketwire) — 12/06/12 — , a leading global provider of high performance imaging solutions, is launching the ELiiXA+ 8k/4k at ITE 2012, in Yokohama, Japan. Based on e2v multi-line CMOS technology, this new camera is the second addition to e2v-s successful ELiiXA+ industrial line scan camera family and is aimed at a broad range of applications, providing high performance, ease of use and robustness at a competitive price.e2v-s ELiiXA+ camera family is designed specifical
TOKYO — (Marketwire) — 12/06/12 — , a leading global provider of high performance imaging solutions, is launching the ELiiXA+ 8k/4k at ITE 2012, in Yokohama, Japan. Based on e2v multi-line CMOS technology, this new camera is the second addition to e2v-s successful ELiiXA+ industrial line scan camera family and is aimed at a broad range of applications, providing high performance, ease of use and robustness at a competitive price.e2v-s ELiiXA+ camera family is designed specifically to provide

HV2809 Reduces PCB Area and Increases System Reliability

Recognized for Creating Technology Innovations in Green Technology

Bückeburg, 7 December 2012 – At the SPS/IPC/Drives trade fair which ended a few days ago (Nuremberg, 27-29 November), the Swedish Bluetooth specialist connectBlue presented the RBE221s Bluetooth access point. The new product replaces the BTWNP331s wireless network platform which is no longer available.
Will Present "Push-Button Verification of Power Optimizations for Xilinx FPGAs," Demonstrate Entire Suite of Formal Verification Tools

New Certification Confirms Smith-s Ability to Meet the Stringent Requirements of the Aerospace Industry

SINGAPORE — 6 DECEMBER 2012, UNITED STATES — (Marketwire) — 12/05/12 — STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced that for the second consecutive year it has been honoured with the "Supplier of the Year" award from Cirrus Logic, Inc. (NASDAQ: CRUS), a leader in high-precision, analog and mixed-signal processing components."Cirrus Logic has b