ColorChip Adds 100G QSFP28 PSM4 Transceiver to Its Portfolio of 100G QSFP28 CWDM4 and 40G QSFP+ LR4/LRL4 Datacenter Solutions

ColorChip Adds 100G QSFP28 PSM4 Transceiver to Its Portfolio of 100G QSFP28 CWDM4 and 40G QSFP+ LR4/LRL4 Datacenter Solutions

YOKNE–AM, ISRAEL — (Marketwired) — 03/18/16 — Editors Note: There are three photos associated with this press release.ColorChip Ltd., a pioneer and innovator in the field of Hyper-Scale Single-Mode Solutions, introduces 100G PSM4 QSFP28 transceiver and adding it to its existing 100G CWDM4/CLR4 offerings.The 100 Gbps family of transceivers are implemented in the Pluggable Quad Small Form factor (QSFP28) package. The PSM4 solution is available with a pigtailed MPO connector, 8 pigtailed LC co

Acacia Communications Ships Over 13,000 of Its Coherent CFP Modules

Acacia Communications Ships Over 13,000 of Its Coherent CFP Modules

MAYNARD, MA — (Marketwired) — 03/18/16 — , a leading provider of high-speed coherent optical interconnect products, today announced that it has shipped over 13,000 coherent modules in its AC100-CFP product family. Acacia released each of the coherent CFP modules in its AC100-CFP product family in 2014 and began shipping in September 2014. In supporting the production ramp for its coherent CFP modules, Acacia qualified additional contract manufacturers beyond those that it had initially quali

Easier bending production with BendingStudio 3.0

Easier bending production with BendingStudio 3.0

Braunschweig/Germany, 17 March 2016 – Just in time for Tube 2016, AICON 3D Systems launches a new version of the software platform BendingStudio. BendingStudio 3.0 offers many new features, which facilitate daily work in bending production. The software platform connects all data and processes around production of bended parts: from production and process planning to manufacturing and quality control. It is the only tool to meet and combine these requirements with emphasis on metrological proces

ClariPhy Shatters Fiber and System Capacity Barriers With Industry–s First 16nm Coherent Optical Networking Platform

ClariPhy Shatters Fiber and System Capacity Barriers With Industry–s First 16nm Coherent Optical Networking Platform

IRVINE, CA — (Marketwired) — 03/17/16 –News HighlightsGame changing performance and power reduction — More than 70 Tbps per fiber and 6.4 Tbps per line cardIndustry leading innovation velocity — world–s first 16nm coherent analog front end platformStrategic alliance with leading optics ecosystem partners — complete 64QAM reference designGround-breaking performance — 400G and beyond per wavelengthSlashes power by more than 50% — 2X increase in system capacity per line card, a leading dev

Hansen Medical(R) to Demonstrate New Magellan(TM) Robotic Catheter eKit and Present Magellan Robotic System at 41st Annual Society of Interventional Radiology (SIR) Scientific Meeting

Hansen Medical(R) to Demonstrate New Magellan(TM) Robotic Catheter eKit and Present Magellan Robotic System at 41st Annual Society of Interventional Radiology (SIR) Scientific Meeting

MOUNTAIN VIEW, CA — (Marketwired) — 03/17/16 — Hansen Medical®, Inc. (NASDAQ: HNSN), the global leader in intravascular robotics, today announced it will exhibit its Magellan Robotic System at the Annual Society of Interventional Radiology (SIR) Scientific Meeting April 2-7 in Vancouver, British Columbia, Canada. The Company will showcase the newly approved Magellan Robotic Catheter eKit that has been used by Interventional Radiologists in a variety of procedures, including Uterine Fibro

Semblant–s CEO Presents Nanocoating Solutions for Semiconductor, MEMS & Semiconductor Packaging at IMAPS 2016

Semblant–s CEO Presents Nanocoating Solutions for Semiconductor, MEMS & Semiconductor Packaging at IMAPS 2016

SCOTTS VALLEY, CA — (Marketwired) — 03/16/16 — , the market leader in protective nanocoatings and liquid damage protection for broad market electronic devices, today announced that CEO Simon McElrea will present the company–s solutions for higher reliability and lower cost semiconductor wafer-level and package-level protection that enables thinner devices. The presentation will take place on March 16, 2016 at 2:30 p.m. as part of the 2016 IMAPS Device Packaging Conference. McElrea will also