STMicroelectronics Extends High-Efficiency Power Family Using New Energy-Saving Package
Innovative 4-Lead Package of Latest MDmesh(TM) V Super-Junction MOSFETs Adds Dedicated Control Input for Increased Switching Efficiency
NVIDIA Announces Upcoming Events for Financial Community
SANTA CLARA, CA — (Marketwired) — 05/03/13 — NVIDIA (NASDAQ: NVDA) will present at the following financial conferences:Wednesday, May 22, at 11:55 a.m. PT (2:55 p.m. ET)
Crowne Plaza Times Square, New YorkTuesday, June 4, at 4 p.m. PT (7 p.m. ET)
Ritz Carlton Hotel, San FranciscoInterested parties can listen to a live audio webcast of NVIDIA-s presentation at each of these events, available on the NVIDIA website at . A replay of each webcast will be available for seven days afterward.Since 1
B&R testing laboratory accredited by Austrian federal ministry
Testing during development increases product quality
Klean Industries CEO Nominated for Entrepreneur & Sustainability Executive of the Year
VANCOUVER, BRITISH COLUMBIA — (Marketwired) — 05/02/13 — Klean Industries Inc. is pleased to announce its CEO, Jesse Klinkhamer, has been nominated for two prestigious awards, the Ernst & Young "Entrepreneur of the Year" and BusinessGreen Leaders Awards "Sustainability Executive of the Year".The Ernst & Young Entrepreneur of the Year recognizes entrepreneurs whose determination and enterprise have created and sustained successful and thriving business endeavors. &
Audience Announces First Quarter 2013 Financial Results
MOUNTAIN VIEW, CA — (Marketwired) — 05/02/13 — Audience, Inc. (NASDAQ: ADNC), the leader in advanced voice and audio processing for mobile devices, today announced its first quarter 2013 financial results.Revenue for the first quarter of 2013 was $47.2 million, compared with $31.1 million for the same period in 2012. As reported under U.S. generally accepted accounting principles (GAAP), first quarter 2013 net income was $4.6 million, or $0.20 per diluted share based on weighted average shar
Vishay Intertechnology-s Tantalum-Cased Wet Tantalum Capacitors for Avionics and Aerospace Now Available With Enhanced Vibration Capability
MALVERN, PA — (Marketwired) — 05/02/13 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that its T16 series of tantalum-cased wet tantalum capacitors with glass-to-tantalum hermetic seals is now available in the A, B, C, and D case codes. For avionics and aerospace applications, the devices have been enhanced with improved vibration (sine: 50 g; random: 27.7 g) capability.Vishay-s T16 electrolytic capacitors provide all the advantages of the company-s SuperTan® series devices w
CentrePointe Business Park to Become New American Headquarters for Beijer Electronics
SALT LAKE CITY, UT — (Marketwired) — 05/02/13 — Cushman & Wakefield | Commerce announced today that Beijer Electronics, Inc. signed a new lease at the CentrePointe Business Park, a research and development park in Salt Lake. Anne Smart SIOR, director with Cushman & Wakefield | Commerce, represented CentrePointe Business Park and Andy Blunt, associate with CBRE, represented Beijer in the transaction.Beijer Electronics, based in Sweden has offices in 19 countries. It is a rapidly-growi
STMicroelectronics Increases Accessibility of MEMS Motion Portfolio by Simplifying Connection to Linux Systems
Linux Industrial-IO-Compatible Drivers for Entire ST MEMS Range Shorten Development Time for Motion Innovations in Multiple Market Sectors
Directional light avoids follow-up costs and complaints
The iLux LightBox makes for concentrated, non-tiring visual surface inspection
MOSIS Collaborates With imec, Tyndall and ePIXfab to Offer Advanced Silicon Photonics Technology
LEUVEN, BELGIUM and MARINA DEL REY, CA — (Marketwired) — 05/02/13 — MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, teams up with imec, Tyndall and ePIXfab — the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs. The partnership gives MOSIS- customers access to imec-s state-of-the-art fully integrated silicon photonics processes and Tyndall-s advanced silicon photonics packaging technology.Imec-s