Stork Veco EMI/RFI Shielding Components Photo-Etched to Customer Specifications

BURLINGTON, MA — (Marketwire) — 12/04/12 — has introduced custom manufactured metallic EMI/RFI shielding components for integration into printed circuit boards and other electronic devices.Stork Veco are from a variety of base materials such as brass, copper, nickel, stainless steel, and steel with various finishes. Manufactured to customer specifications, they can be supplied as one- or two-piece fabrications, flat or formed, and can incorporate slots and holes, half-etch bend lines, tab

Laser Research Optics- C02 Laser Mirrors Feature Enhanced Silver DMBR Coating

PROVIDENCE, RI — (Marketwire) — 12/04/12 — is offering a full line of for use in both high- and low-power lasers. Optimized for 10.6 µm @45 degrees AOI, they are made from silicon with an enhanced silver DMBR coating to provide up to 99.6% reflectivity.are offered in 3/4" to 3" dia. sizes, from 2 to 10 mm thick, with +0.000"/-0.005" tolerances, and meet ISO-10110 and OEM specifications. Suitable for OEMs and as field replacements for end-users, these are made fr

Suntron Corporation Increases Placement and Inspection Capabilities for Miniaturized Medical Devices

Suntron Corporation Increases Placement and Inspection Capabilities for Miniaturized Medical Devices

PHOENIX, AZ — (Marketwire) — 12/04/12 — With medical device OEMs requiring smaller, lighter, and longer lasting devices, Suntron Corporation, a leader in integrated electronics manufacturing systems (EMS) and embedded computing solutions, announces that it has the capability to place and inspect the tiny packages needed for miniaturized medical device electronics.Suntron builds highly complex boards with 01005 components requiring the control of many variables during assembly process. The 01

NXP Semiconductors Announces New Refinancing

NXP Semiconductors Announces New Refinancing

EINDHOVEN, THE NETHERLANDS — (Marketwire) — 12/04/12 — NXP Semiconductors N.V. (NASDAQ: NXPI) (together with its subsidiaries, "NXP") announced today that its subsidiary, NXP B.V., launched a transaction seeking commitments for up to US$500 million in new senior secured loans ( the ""), the proceeds of which would be used to fund NXP B.V.-s currently ongoing offer to purchase up to US$500 million in cash of the U.S. dollar-denominated 9 3/4 % Senior Secured Notes due 2018

Vishay Intertechnology Captures Three Spots on EDN Magazine-s List of Hot 100 Products for 2012

Vishay Intertechnology Captures Three Spots on EDN Magazine-s List of Hot 100 Products for 2012

MALVERN, PA — (Marketwire) — 12/03/12 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that three of its products were featured in EDN magazine-s prestigious list of Hot 100 Products for 2012, which highlights the electronics industry-s most significant products of the year based on innovation, significance, usefulness, and popularity. Vishay-s VLMx1500-GS08 series of ultra-bright LEDs and VSMY7852X01 and VSMY7850X01 infrared (IR) emitters were included in the Optoelectronics and L

Vishay Intertechnology Releases Fully Integrated Proximity Sensor Combining IR Emitter, Photo-Pin-Diode, Signal Processing IC, and 16-Bit ADC in Compact 4.85 mm x 2.35 mm x 0.83 mm Package

Vishay Intertechnology Releases Fully Integrated Proximity Sensor Combining IR Emitter, Photo-Pin-Diode, Signal Processing IC, and 16-Bit ADC in Compact 4.85 mm x 2.35 mm x 0.83 mm Package

MALVERN, PA — (Marketwire) — 12/03/12 — Vishay Intertechnology, Inc. (NYSE: VSH) today added to its optoelectronics portfolio by introducing a fully integrated proximity sensor that combines an IR emitter, photo-pin-diode, signal processing IC, and 16-bit ADC in one small 4.85 mm x 2.35 mm x 0.83 mm surface-mount package. The space-saving VCNL3020 supports an easy-to-use I²C bus communication interface, and it features an interrupt function and an integrated external emitter driver to e

OPEL Technologies Inc. Announces New CFO

OPEL Technologies Inc. Announces New CFO

SHELTON, CONNECTICUT and TORONTO, ONTARIO — (Marketwire) — 11/30/12 — OPEL Technologies Inc. (TSX VENTURE: OPL) ("OPEL" or "the Company"), a semiconductor device and process developer, announced today a change to its Management Team. Michael McCoy has resigned as Treasurer and Chief Financial Officer (CFO) of the Company and its subsidiaries in order to pursue new personal ventures. Mr. McCoy served as CFO of the Company since January 2007 and of OPEL Solar, Inc. since 2

tde supplies all kinds of LC adapters with translucid dust caps as standard

tde supplies all kinds of LC adapters with translucid dust caps as standard

Dortmund, 30. November 2012. tde – trans data elektronik, a leading manufacturer, distributor and system provider of network technology and a pioneer in the field of fiber optic multi-fiber technology, now offers every LC duplex adapter in tML-modules with translucid dust caps as regular production. In this way, a network breakdown caused by the ingression of dust into the ports can generally be prevented. In addition, the translucid material renders the installation as well as the maintenance e