IDT Introduces RF Switch Supporting DOCSIS 3.1 Cable Networking Equipment
The F2970 Broadband SPDT Absorptive RF Switch is the First in a Family of High-Linearity 75-Ohm Switches Supporting the Next Generation of Cable Standards
Advantest Unveils New Pick-and-Place IC Handler to Improve Efficiency in High-Volume Semiconductor Manufacturing and Device Characterization
M4872 System is Designed with a Common Change Kit to Meet Customers– Needs for Greater Flexibility and Higher Performance
Growing Advancements in Interactive Residential Security Market will see an Increase in Sales up to 2021
Study provides a brief overview on the residential security market and its sales. report extensively provides the market share, growth, trends and forecasts for the period 2011-2021.
Hengtong Is Awarded Core Partner of Huawei in 2016
SUZHOU, CHINA — (Marketwired) — 12/01/16 — Hengtong was ranked as "Huawei–s Core Partner in 2016" recently at Huawei–s 10th CPC, which was the fifth time in for Hengtong to be granted this honor.Huawei has big-scale supply chains and lots of partners in the world, and the "Core Partner" Award is a recognition of the outstanding ones among them.Hengtong has kept providing large quantities of products and system solutions for Huawei these years and relied on the innovati
Evertz Technologies reports results for the Second Quarter Ended October 31, 2016 and Special Dividend
BURLINGTON, ONTARIO — (Marketwired) — 12/01/16 — Evertz Technologies Limited (TSX: ET), the leader in Software Defined Video Network ("SDVN") technology, today reported its results for the second quarter ended October 31, 2016.Quarter HighlightsRevenueFor the quarter ended October 31, 2016, revenues were $99.6 million as compared to revenues of $100.6 million for the quarter ended October 31, 2015. For the quarter, revenues in the United States/Canada region were $62.3 million, an
P10 Industries Announces Delisting and Deregistration of Common Stock
AUSTIN, TX — (Marketwired) — 11/30/16 — P10 Industries, Inc. (OTC PINK: PIOI) today announced it has filed with the U.S. Securities and Exchange Commission (SEC) a Form 25 ("Notification of Removal from Listing and/or Registration under Section 12(b) of the Securities Exchange Act of 1934") to effect the voluntary delisting of the company–s common stock from the NASDAQ Capital Market (NASDAQ) and the deregistration of the common stock under Section 12(b) of the Securities Exchange
Cherubim Interests, Inc. Retires Additional Debt
DALLAS, TX — (Marketwired) — 11/30/16 — Cherubim Interests, Inc. (OTC PINK: CHIT) ("the Company"), an expansion-stage alternative construction and real estate development company, announces that it has successfully retired an additional $667,391 of Principal Debt from the Company–s books."We are happy to report that the Company has been successful in its efforts of retiring the majority of our outstanding principal debt over the past twelve months," said CHIT CEO Patrick
Bel Will Participate in LD Micro Main Event Investor Conference in Los Angeles, December 6-8, 2016
JERSEY CITY, NJ — (Marketwired) — 11/30/16 — Bel Fuse Inc. (NASDAQ: BELFA) and (NASDAQ: BELFB) ("Bel" or "the Company") today announced that it will participate in the LD Micro "Main Event" Investor Conference being held in Los Angeles, on December 6-8, 2016. The conference is being held at the Luxe Sunset Bel Air Hotel.VP of Finance, Colin Dunn, and Financial Reporting Manager, Lynn Hutkin will represent Bel management and provide a group presentation at 9:00 A
Hengtong Deeply Impresses Congo–s Telecom Minister
SUZHOU, CHINA — (Marketwired) — 11/29/16 — Congo–s telecom minister Leon Juste Ibombo visited Hengtong and held a cordial talk with Qian Jianlin, Hengtong–s CEO, on November 12.China is ready for new opportunities for China-Africa cooperation and happy to take part in the construction of Congo–s telecommunication, according to Qian Jianlin. Meanwhile, Ibombo said that Hengtong was welcome to the developments of Congo–s telecom industry.Ibombo was deeply impressed by Hengtong–s equipment
ICScape SPICE Simulator Chosen by Kilopass for Pre- and Post-Layout Simulation of Memory IP
SPICE Simulator Noted for Post-Layout Simulation Capabilities for Analog/Mixed-Signal Designs with Complex Interconnect Delays at 40nm and Below