One Source Networks Joins Console NSP Partner Program

Relationship Enables OSN to Provide Customers With Direct Access to a Broad Ecosystem of Cloud and SaaS Providers

Relationship Enables OSN to Provide Customers With Direct Access to a Broad Ecosystem of Cloud and SaaS Providers

Signal Insights Enables Mobile Operators, System Integrators, Venue Owners and M2M Players to Better Manage Indoor Cellular and Wi-Fi User Experiences

Company Further Scales Platform by Adding Over 200,000 Unique Assets and Considerable User Experience Improvements

The TELUS Global IoT Connectivity Platform enables Canadian businesses to seamlessly scale their operations across more than 200 networks in nearly every country around the world

OTTAWA, CANADA — (Marketwired) — 09/09/15 — WiLAN (TSX: WIN) (NASDAQ: WILN) today announced that the Company–s subsidiary, Collabo Innovations Inc., has entered into a patent license agreement with STATS Chip PAC Ltd for technology related to semiconductor packaging. This technology is used in a variety of electronic devices, such as televisions, computers, and printers. WiLAN acquired the patents from Panasonic in 2013.STATS Chip PAC is a leading service provider of semiconductor packagin

The TELUS Global IoT Connectivity Platform enables Canadian businesses to seamlessly scale their operations across more than 200 networks in nearly every country around the world

Full-Featured, Next-Generation Location and Messaging Unit Leverages CalAmp–s New Embedded Vehicle Interface Technologies to Enable Exceptional Value Across a Wide Range of Industries

As a Leading Provider of Metro 100G Solutions, BTI Becomes Part of Software-Driven Ecosystem That Enables Simple and Direct Interconnection Between Enterprises, Network Providers and Cloud Providers

The Industry–s First Nationwide Network Is Purpose-Built Exclusively for M2M / IoT Connectivity

Expanded Leadership Team Creates Strategic Vision of the Machine Network(TM)