At ISTFA 2011, DCG Systems to Showcase Non-Destructive 3D Defect Localization

At ISTFA 2011, DCG Systems to Showcase Non-Destructive 3D Defect Localization

FREMONT, CA — (Marketwire) — 11/16/11 — DCG Systems, Inc. is exhibiting at the 37th annual International Symposium for Testing and Failure Analysis (ISTFA) November 15-16 at the San Jose Convention Center. They will be in booth #401 to engage ISTFA attendees with DCG-s extensive product portfolio and in particular will announce ELITE software optimized for the non-destructive 3D defect localization in packaged semiconductor devices. The ELITE has proven effective in identifying defects with