Ability to simultaneously wipe 40 phones at top speed while conforming to stringent NIST media sanitization standard optimizes data security for After Market Services (AMS) providers, wireless retailers and their customers
Comprehensive Certification Gauges Security of Technology Components and Reflects MovieLabs– Enhanced Content Protection Specification
OTTAWA, CANADA — (Marketwired) — 09/09/15 — WiLAN (TSX: WIN) (NASDAQ: WILN) today announced that the Company–s subsidiary, Collabo Innovations Inc., has entered into a patent license agreement with STATS Chip PAC Ltd for technology related to semiconductor packaging. This technology is used in a variety of electronic devices, such as televisions, computers, and printers. WiLAN acquired the patents from Panasonic in 2013.STATS Chip PAC is a leading service provider of semiconductor packagin
Ability to simultaneously wipe 40 phones at top speed while conforming to stringent NIST media sanitization standard optimizes data security for After Market Services (AMS) providers, wireless retailers and their customers
The TELUS Global IoT Connectivity Platform enables Canadian businesses to seamlessly scale their operations across more than 200 networks in nearly every country around the world
Using Newly Released SoFi ts Software From thinkstep, Company Manages Sustainability Across the Corporation and Its Supply Chain
Data Center Meets Increasing Enterprise Demand for Premium Colocation Services; Two of Five Compartments Leased to Fortune 500 Companies
Showcasing ContentsAnalyzer, the Industry–s First Fraud Detection System That Roots Out Anomalies at the Claim Line Level as Claims Are Processed
The successful software of community4you AG has reformed the fleet management of the company.
Full-Featured, Next-Generation Location and Messaging Unit Leverages CalAmp–s New Embedded Vehicle Interface Technologies to Enable Exceptional Value Across a Wide Range of Industries