New thermal test applications from ERS enable higher throughput

New thermal test applications from ERS enable higher throughput

MUNICH, January, 31, 2013 – ERS electronic GmbH, market leader in the field of thermal wafer chucks in semiconductor production, is broadening the range of applications for its proven air-only cooling technology. New products coming out this year from the German high-tech company will make the native advantages of this technology available to applications beyond those that originally made air-cooling so successful in semiconductor thermal test. The new products, currently in the prototype stage,