Synapse Design Hosts Key European and Asian Editors at Globalpress Event
Synapse Design to Announce and Demo New Product at Euroasia Press Event
What–s New in 16nm Embedded Memory IP and Semiconductor Quoting Automation
eSilicon–s Lisa Minwell to Present "Winning the IoT Race With the Right Chip"
NXP Brings High Efficiency to 12V MR16 Lamps With Dimmable LED Controller
SSL3401 Is a Compact, Cost-Effective GreenChip Solution Compatible With a Wide Range of Dimmers and Transformers
Spreadtrum Adopts STATS ChipPAC-s Innovative Packaging for China-s Smartphone Market
eWLB Packaging Technology Platform Delivers Transformative Performance and Form Factors at Competitive Cost for Spreadtrum-s Mobile Chipsets
REMINDER: 4th Asia Symposium on Quality Electronic Design (ASQED) Announces Extended Call for Papers; Convenes July 10-11, Penang, Malaysia
ASQED Paper Submission Deadline Extended to April 23, 2012
4th Asia Symposium on Quality Electronic Design (ASQED) Announces Extended Call for Papers; Convenes July 10-11, Penang, Malaysia
ASQED Paper Submission Deadline Extended to April 23, 2012
Teledyne DALSA Semiconductor Announces Sample & Hold Precision Linear Amplifier IC for High Density MEMS/MOEMS Systems
WATERLOO, ONTARIO — (Marketwire) — 04/05/12 — Editors Note: There is one photo associated with this press release., a Teledyne Technologies company, announced today the availability of its . Using proprietary High Voltage CMOS/DMOS technology, the DH9665A is designed for next-generation, high density, small footprint, low power system requirements using MEMS or MOEMS activation with electrostatic forces. This device showcases Teledyne DALSA Semiconductor-s suite of product development and ma
Teledyne DALSA Semiconductor Announces Electrostatic Actuator Integrated Circuit for High Density MEMS/MOEMS Systems
WATERLOO, ONTARIO — (Marketwire) — 02/28/12 — Editors Note: There is a photo associated with this press release., a Teledyne Technologies company, announced today the availability of its . Using proprietary High Voltage CMOS/DMOS technology, the DH9685AB is designed for next-generation, high density, small footprint, low power system requirements using MEMS or MOEMS activation with electrostatic forces. This device showcases Teledyne DALSA Semiconductor-s suite of product development and man
SuVolta Raises $17.6 Million in Venture Funding
Funding to Accelerate Development of Industry-Changing, Low-Power Chip Technology for Mobile Devices and Other Digital Products
NXP Achieves Quantum Leap With Infrastructure Reader IC CLRC663
Launches First NFC-Ready, Universal Contactless Reader IC for Multiple ID Applications