PLX to Demonstrate, Present on Implementing PCI Express Fabrics in Data Centers at Supercomputing Conference

Highlights PCIe as Standalone Box-to-Box Fabric Within the Rack Using Standard Copper, Optical Cabling

Highlights PCIe as Standalone Box-to-Box Fabric Within the Rack Using Standard Copper, Optical Cabling

SUNNYVALE, CA and TAIPEI, TAIWAN — (Marketwired) — 10/17/13 — , Inc. (NASDAQ: PLXT), the global leader in PCI Express® (PCIe®) silicon and software connectivity enabling emerging data center architectures, today announced that Hung Chi, PLX® field applications director for the APAC region, will present on using PCIe for rack-level consolidation and convergence into a single interconnect technology during the upcoming , in Taipei, Taiwan. Chi-s presentation, titled , will cover ho

SUNNYVALE, CA — (Marketwired) — 09/11/13 — (NASDAQ: PLXT), the global leader in PCI Express® (PCIe®) silicon and software connectivity solutions enabling emerging data center architectures, today announced its fully support and enhance the new Intel® Ivy Bridge® processor family. The combination of PLX® switches and PCIe-native Ivy Bridge processors enable high-performance servers in data centers and cloud computing environments to realize unprecedented interconnect des

SUNNYVALE, CA — (Marketwired) — 07/29/13 — (NASDAQ: PLXT), the global leader in PCI Express® (PCIe®) silicon and software connectivity solutions enabling emerging data center architectures, today announced that Larry Chisvin, PLX® vice president of strategic initiatives, will chair a session on the blend of PCIe and solid-state drives (SSDs), at the upcoming . The PLX led session, titled features an array of panelists from industry leaders including , , , and . The session can

Free Event Highlights PCIe Gen3 Architecture, Design Fundamentals

Silicon-Proven MIPI Low Latency Interface (LLI) Digital Controller IP Enables Smaller and Thinner Phones, Reduces Compatibility Risk

Exclusive Eighth Annual User Conference Returns to Miami

Retains Patent Litigation Counsel, Files Patent Infringement Claim Against SonicsGN (SGN) Interconnect, and Asserts Non-Infringement and Invalidity of Sonics Patents

C2C(TM) Chip-to-Chip Link IP Enables Lower Bill of Materials (BOM) Cost for TD-SCDMA and TD-HSPA Mobile Phones

100 ns Latency Allows Mobile Phone Applications Processors and Modems to Share a Single DRAM, Saving $2 in Electronic Bill of Materials (BOM) Cost