Meller Sapphire Wafer Carriers Assure Consistent Part-to-Part Uniformity
PROVIDENCE, RI — (Marketwired) — 09/22/15 — has introduced a series of custom fabricated that feature uniform thickness and parallelism and are highly durable for thinning semiconductors.feature Moh 9 hardness, which is second only to diamond, allowing them to be produced as thin as 0.018" with 1.2 micron uniform thickness and 10 arc-sec. parallelism. Custom perforated with hole patterns to fit vacuum hold-down or de-lamination fixtures, they facilitate semiconductor thinning to assur