NANIUM Extends eWLB to Achieve Higher Reliability
VILA DO CONDE, PORTUGAL — (Marketwired) — 10/29/13 — NANIUM S.A., Europe-s largest outsourced semiconductor assembly and test (OSAT) service provider, today announced the introduction of an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level ball grid array (eWLB). These improvements increase eWLB-s reliability, thereby extending the existing technology platform into more demanding markets and applications including