Sensor Modules Win $4.3 Billion in Funding Over Past Decade as IoT Heats Up
Developers of Innovative Sensors Cornered Nearly 80% of the Investment Due to Demand From the Internet of Things, Says Lux Research
StockPKG Selects PipelineDeals to Gain Sales Insights and Optimize Workflows to Increase Recurring Business Revenue
CRM Maximizes Opportunities From Customer Relationships to Achieve Business Goals
STATS ChipPAC Honored With Supplier of the Year Award From Inphi
SINGAPORE — 1 MARCH 2016, UNITED STATES — (Marketwired) — 02/29/16 — STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test services, today announced that it has been honored with the "Supplier of the Year" award from Inphi Corporation (NYSE: IPHI), a leading provider of high-speed, mixed-signal semiconductor solutions for the communications, computing and data center markets."With the rapidly
STATS ChipPAC Ranked in Top 10 Semiconductor Equipment Manufacturing Companies by IEEE for Patent Innovations
Highest Ranking Ever Received for an OSAT Provider
Cavendish Kinetics Adopts STATS ChipPAC–s Wafer Level Technology for Its SmarTune(TM) RF MEMS Tuners
Innovative RF MEMS Antenna Tuners Leverage Advanced Wafer Level Packaging to Provide OEMs With High Quality Chip Scale Packages
Southern Graphics Extends Reach of Digimarc(R) Barcode to Premier Retail and Brand Customers
SGS Customers Can Now Easily Integrate Digimarc Barcode for Faster Checkout and Enhanced Mobile Shopper Engagement
STATS ChipPAC Receives Top 20 Semiconductor Manufacturing Patent Ranking for Fourth Consecutive Year
SINGAPORE–17 DECEMBER 2014, UNITED STATES — (Marketwired) — 12/16/14 — STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked for the fourth consecutive year among the world–s top 20 semiconductor manufacturing companies in the Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers (IEEE), the
Teledyne DALSA to Showcase Vision Inspection Solutions at Pack Expo International
WATERLOO, ONTARIO — (Marketwired) — 10/23/14 — (NYSE: TDY), a Teledyne Technologies company and global leader in machine vision technology, will feature the latest advancements for packaging and processing applications at Pack Expo International 2014, in South Hall Booth S-4147. , the leading show dedicated to the latest advancements in packaging materials, containers, machinery, will be held in Chicago, on November 2-5, 2014.Teledyne DALSA will showcase its smart cameras and multi-camera s
Digimarc Becomes GS1 US Solution Partner
Digimarc(R) Barcode Offers Retailers Faster Checkout and Enhanced Mobile Consumer Engagement
Staples Launches New Digital Label and Packaging Offering With HP Indigo Presses
PALO ALTO, CA — (Marketwired) — 10/17/13 — HP (NYSE: HPQ) today announced that , the printing division of , has transformed its printed label and packaging offerings with the installation of two .Growth in Staples- prime label and flexible packaging business has fueled greater demand for digital production from customers interested in shorter printing runs and higher levels of customization. To meet this demand, Staples is expanding its label and packaging manufacturing beyond the convention