STATS ChipPAC Ranked in Top 10 Semiconductor Manufacturing Companies by the IEEE for Its Patent Innovations
STATS ChipPAC-s Patent Portfolio Recognized for Its Quality, Strength and Overall Importance to the Semiconductor Manufacturing Industry
STATS ChipPAC Completes Expansion of 300mm Wafer Bump and WLCSP Operation in Taiwan
Capacity Expansion Supports Comprehensive Offering of Full Turnkey Wafer Bump and Wafer Level Packaging for Advanced 40um Technology