Cascade Microtech Introduces SELECTShip(TM) Logistics Program to U.S. Customers
New Program Provides Flat-Rate Pricing for Door-to-Door Service
Data I/O Corporation Celebrates 40 Years of Innovative Programming Solutions for the Electronics Industry
REDMOND, WA — (Marketwire) — 12/12/12 — Data I/O Corporation (NASDAQ: DAIO), the leading provider of manual and automated device programming solutions, is celebrating 40 years of delivering innovative programming solutions to the electronics industry. For the past four decades Data I/O has developed innovative solutions to enable the design and manufacture of electronic products including mobile devices, infotainment systems, navigation equipment, industrial controls, engine control units an
REMINDER: Media Alert: OneSpin Solutions Named Silver Sponsor of ARM Technology Symposium 2012 Paris
Will Present "Push-Button Verification of Power Optimizations for Xilinx FPGAs," Demonstrate Entire Suite of Formal Verification Tools
RS Components Gives Lifeline to Young Engineers
Donation to Tresham College of Further and Higher Education will help develop manufacturing talent of the future
Shipments of Lattice iCE FPGA Family Reach 15 Million
Ultra-Low Density FPGAs Reach Historic Shipment Level, Will Be Featured at CES 2013
SOPAC Cellular Solutions Inc. Announces David F. Levy Has Joined the Company as CEO and New Business Focus
SHERMAN OAKS, CA — (Marketwire) — 12/11/12 — SOPAC Cellular Solutions Inc. (OTCBB: SOPC), SOPAC Cellular Solutions Inc. ("SOPAC") announced today that Mr. David F. Levy has joined the company as its new CEO, President, Secretary and Director. Mr. Levy boasts lifelong success as a technology executive, entrepreneur, and business-builder. Most recently Mr. Levy was the founder, Chairman and CEO of Inzon Corporation, a Voice Over Internet Protocol ("VoIP") technology company
New Wireless Temperature and Humidity Transmitter Features Fastest, Simplest Installation Ever
HELSINKI, FINLAND — (Marketwire) — 12/11/12 — Vaisala has launched a new wireless version of its Continuous Monitoring System (CMS)* which allows secure monitoring, alarming and reporting of temperature, relative humidity, CO2, differential pressure, contacts and other critical parameters in Life Science applications. Thanks to its ability to connect to any existing network and therefore eliminating the need for any extra transmitter equipment, the new device-the Vaisala HUMICAP® Wireles
NXP Announces a New Financing and the Expiration and Results of the Tender Offer for Its 9 3/4% Senior Secured Notes Due 2018
EINDHOVEN, THE NETHERLANDS — (Marketwire) — 12/11/12 — NXP Semiconductors N.V. (NASDAQ: NXPI) (together with its subsidiaries, "NXP") today announced that NXP B.V. and NXP Funding LLC, as borrowers, entered into a new $500 million senior secured term loan facility on December 10, 2012, with Deutsche Bank Securities Inc., Merrill Lynch, Pierce, Fenner & Smith Incorporated and Goldman Sachs Bank USA, as arrangers (the "New Term Loan"), and also announced the expiration
STMicroelectronics Announces Its 28nm FD-SOI Technology Is Ready for Manufacturing in Its Leading-Edge Crolles Fab
Silicon-Verified Process Technology Delivers 30% Higher Speed and up to 50% Improvement in Power
Lighting Science Group Files 71 New Patents in 2012
LSG Continues to Innovate With New Technology and Expanding Patent Portfolio