FormFactor Features Advanced Copper Pillar Probing Solutions for SoC Devices at SEMICON West

FormFactor Features Advanced Copper Pillar Probing Solutions for SoC Devices at SEMICON West

LIVERMORE, CA — (Marketwired) — 07/08/13 — At SEMICON West this week . (NASDAQ: FORM) will stage a strong presence through executive participation in key forums and sponsorship of select industry initiatives. At each venue, FormFactor will feature its advanced copper pillar probing solutions — now deployed in volume production by leading semiconductor customers to test 28nm System-on-Chip products.The anchor event of the week is — a premier two-day program happening on Wednesday and Thurs

COREwafer Industries, Inc. Announces New Board of Directors

COREwafer Industries, Inc. Announces New Board of Directors

NEW YORK, NY — (Marketwired) — 07/08/13 — COREwafer Industries, Inc. (PINKSHEETS: WAFR) announced today the individuals who will join the newly structured COREwafer Industries, Inc. Board of Directors.In line with COREwafer Industries- 2013-2015 Strategic Plan, the new Board will complement the strategic direction of the organization moving forward. Moving away from simply reporting annual beneficiaries, COREwafer Industries is committed to annually measuring the long-term impact of its proj

STMicroelectronics Announces Timing for 2nd Quarter 2013 Earnings Release and Conference Call

STMicroelectronics Announces Timing for 2nd Quarter 2013 Earnings Release and Conference Call

GENEVA — (Marketwired) — 07/08/13 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will release second quarter 2013 earnings after the close of trading on the New York Stock Exchange on Monday, July 22, 2013.The press release will be available immediately after the release on the Company-s website at .The management of STMicroelectronics will conduct a conference call on July 23, 2013 at 9:00

Bridgelux and Future Electronics Sign Global Distribution Agreement for Bridgelux Product Portfolio

Bridgelux and Future Electronics Sign Global Distribution Agreement for Bridgelux Product Portfolio

LIVERMORE, CA — (Marketwired) — 07/08/13 — , a leading developer and manufacturer of LED lighting technologies and solutions, has signed a global distribution agreement with Future Electronics, a world class leader and innovator in the distribution and marketing of electronic components. Under the new agreement, Future Electronics- lighting division, Future Lighting Solutions, will provide global sales, design support and fulfillment services for Bridgelux-s portfolio of LED products sold th

Advantest Introduces New V93000 Mobile PMIC Solution Designed for Cost-Efficient, Massively Parallel Testing of PMICs and Other SoC Semiconductors

TOKYO — (Marketwired) — 07/08/13 — Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) (NYSE: ATE) has entered the market for testing system-on-chip (SoC) mobile power-management ICs (PMIC) by delivering the semiconductor industry-s most cost-compelling solution using the V93000 platform. Compatible with Advantest-s large global installed base of V93000 systems, the new solution has the flexibility to perform massive multi-site testing of complex SoC devices and s

Nuvolt Corporation Announces the Deposit of its Quarterly Financial Statements as at May 31, 2013

Nuvolt Corporation Announces the Deposit of its Quarterly Financial Statements as at May 31, 2013

LEVIS, QUEBEC — (Marketwired) — 07/05/13 — Nuvolt Corporation Inc. ("Nuvolt") (TSX VENTURE: NCO) announces the filling of its quarterly financial statements for the third quarter of the fiscal year 2012-2013, ended May 31, 2013."Nuvolt-s turnover continues to increase, especially in the agriculture market in the U.S. It exceeds by nearly 5% the twelve-month period ended August 31, 2012." says Mr. Gilles Roy, Chief Executive Officer. "The backlog is well filled to st

EuroMold 2013 – Innovations and new highlights to mark the 20th Anniversary

20th Anniversary of the EuroMold trade fair from 3 to 6 December at the exhibition halls in -Frankfurt/Main – A variety of innovations, new systems solutions and products, as well as a multitude of new special topics and special events – new themes and innovations: Lightweight construction, hybrid technology, rotation molding, thermoforming and engineering services – this year-s partner country: I