VerifyMe Provides Corporate Update and Business Outlook

Update Highlights VerifyMe–s Achievements Over the Past Quarter and Provides Upcoming Goals and Strategic Milestones

Update Highlights VerifyMe–s Achievements Over the Past Quarter and Provides Upcoming Goals and Strategic Milestones

Company Relocates to New High-Tech Offices to Support Planned Growth

Platform Provides iTel Networks Customers with Direct Private Connections to Major Cloud and SaaS Providers

One of the Nation–s Busiest Ports Will Use AtHoc Connect(TM) to Achieve Real Time Interoperable Communication for More Than 150 Commercial and Federal Partners

Ability to simultaneously wipe 40 phones at top speed while conforming to stringent NIST media sanitization standard optimizes data security for After Market Services (AMS) providers, wireless retailers and their customers

Comprehensive Certification Gauges Security of Technology Components and Reflects MovieLabs– Enhanced Content Protection Specification

OTTAWA, CANADA — (Marketwired) — 09/09/15 — WiLAN (TSX: WIN) (NASDAQ: WILN) today announced that the Company–s subsidiary, Collabo Innovations Inc., has entered into a patent license agreement with STATS Chip PAC Ltd for technology related to semiconductor packaging. This technology is used in a variety of electronic devices, such as televisions, computers, and printers. WiLAN acquired the patents from Panasonic in 2013.STATS Chip PAC is a leading service provider of semiconductor packagin

Ability to simultaneously wipe 40 phones at top speed while conforming to stringent NIST media sanitization standard optimizes data security for After Market Services (AMS) providers, wireless retailers and their customers

The TELUS Global IoT Connectivity Platform enables Canadian businesses to seamlessly scale their operations across more than 200 networks in nearly every country around the world

Using Newly Released SoFi ts Software From thinkstep, Company Manages Sustainability Across the Corporation and Its Supply Chain