Recent Advances in Embedded Wafer Level Packaging Technology Reduce Bottom Package Height to Less Than 0.3mm for an Overall PoP Stack Height as Low as 0.8mm
Partnership to Advance Breakthrough Solutions for Next Generation Semiconductor Packaging Technologies
SINGAPORE–23 JULY 2013, UNITED STATES — (Marketwired) — 07/22/13 — STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24) today announced the recipients of its sixth annual Supplier Awards, honouring the Company-s top suppliers in recognition of their excellent performance and outstanding support in 2012. The Supplier Awards program is designed to drive leadership in supply management to deliver the highest level of service, value and innovat
Commitment to Innovation and Strong Focus on Advanced Wafer Level Technology Deliver Broad Portfolio of Intellectual Property
Award Submission Chronicles Successful Deployment of Custom Corrugated Packaging B2B eCommerce Site in Less Than 90 days for Customer Great Northern Corporation
Attendees to Get a Comprehensive Look at How Digital Watermarking Can Be Used Across Media to Connect With Shoppers via Their Mobile Devices
BEAVERTON, OR — (Marketwired) — 04/25/13 — Digimarc Corporation (NASDAQ: DMRC) will hold a conference call on Thursday, May 2, 2013 at 5:00 p.m. Eastern time (2:00 p.m. Pacific time) to discuss results for the first quarter ended March 31, 2013. Financial results will be issued in a press release prior to the call.Digimarc Chairman and CEO Bruce Davis and CFO Michael McConnell will host the presentation.The call will be broadcast live via webcast at and , and will be available for replay un
Readers of The Costco Connection Scan Transparent Digital Watermarks for Mobile Commerce, Additional Product Details, Store Information and More
ERP Solution Provides More Accurate Quotes, Speeds Printing Process
eWLB Packaging Technology Platform Delivers Transformative Performance and Form Factors at Competitive Cost for Spreadtrum-s Mobile Chipsets