STATS ChipPAC Ranked in Top 10 Semiconductor Manufacturing Companies by the IEEE for Its Patent Innovations
STATS ChipPAC-s Patent Portfolio Recognized for Its Quality, Strength and Overall Importance to the Semiconductor Manufacturing Industry
STATS ChipPAC Honoured With Second Consecutive Supplier of the Year Award From Cirrus Logic
SINGAPORE — 6 DECEMBER 2012, UNITED STATES — (Marketwire) — 12/05/12 — STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced that for the second consecutive year it has been honoured with the "Supplier of the Year" award from Cirrus Logic, Inc. (NASDAQ: CRUS), a leader in high-precision, analog and mixed-signal processing components."Cirrus Logic has b
STATS ChipPAC Completes Expansion of 300mm Wafer Bump and WLCSP Operation in Taiwan
Capacity Expansion Supports Comprehensive Offering of Full Turnkey Wafer Bump and Wafer Level Packaging for Advanced 40um Technology
Industry-Leading Lattice MachXO2 PLD Family Now Available in Small WLCSP Package
Extremely Small Footprint and Over 100X Power Reduction Highlight Benefits for Low Density PLD Designers
Factory layout or problem spot analysis is easier with modelling service for process plant owners
CAD Schroer delivers 3D factory model and CAD files for plant adaptation planning – a Total Processing & Packaging 2010 exclusive