SUNNYVALE, CA — (Marketwire) — 03/21/13 — eSilicon Corporation, the largest independent semiconductor design and manufacturing services provider, today announced the addition of Subramaniam (Hari) Hariharan to its executive team as vice president, global manufacturing operations."Hari will lead our global manufacturing and operations (GMO) team to further drive excellence in quality, speed and cost effectiveness to our global customer base," said Jack Harding, eSilicon-s president
WILMINGTON, MA — (Marketwire) — 03/20/13 — Implant Sciences Corporation (OTCQB: IMSC), a high technology supplier of systems and sensors for homeland security markets, announced today the nationwide airing of a story featuring the Company by Fox News. The report, which aired Sunday, March 17, 2013, notes that Implant Sciences- Quantum Sniffer QS-B220 was recently approved by the Transportation Security Administration (TSA).Implant Sciences- President and CEO, Glenn D. Bolduc, commented that,
SINGAPORE–20 MARCH 2013, UNITED STATES — (Marketwire) — 03/20/13 — STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced that it has given notice to the holders of its outstanding $241.6 million of 7.5% Senior Notes due 2015 (the "Existing Notes"), with ISIN/CUSIP: 85771TAH7, Y8162BAE5, US85771TAH77 and USY8162BAE57, to exercise its option to
SANTA CLARA, CA — (Marketwire) — 03/19/13 — Tensilica®, Inc. today announced that it has joined the HSA (Heterogeneous System Architecture) Foundation, a not-for-profit consortium dedicated to developing architecture specifications that will unlock the performance and power efficiency of parallel computing engines found in many modern devices. Tensilica will contribute its years of experience assisting customers in bringing heterogeneous multicore SoC (system-on-chip) designs to market t
