STMicroelectronics in Cooperation With Soitec Makes 28nm FD-SOI CMOS Process Available Through CMP
Semiconductor Technology Leaders ST, Soitec and CMP Help Universities, Research Labs and Companies Prototype Next Generation of Systems-on-Chip
GaN Systems Expands to New US Location
New business development director heads new office in Ann Arbor, Michigan
ST Innovation Brings Digital Amplifiers to the Dashboard for Better In-Car Audio, Energy Efficiency and Space Savings
Full-Digital Amplifier Family Begins With 4x135W and 4x50W Systems on Chip, Enabling a New Generation of Class-D Car Audio Products
QuickLogic to Participate at MIPI Alliance Member Demo Day
SUNNYVALE, CA — (Marketwire) — 10/15/12 — QuickLogic Corporation (NASDAQ: QUIK), the innovator in low-power Customer Specific Standard Products (), today announced that it will be exhibiting at the MIPI Alliance Member Demo Day in Miami, FL. QuickLogic will be demonstrating the capabilities of the ArcticLink® III VX product line, a CSSP solution including QuickLogic-s Visual Enhancement Engine (VEE) and Display Power Optimizer (DPO) technologies.Location: Hyatt Regency Miami, Miami, FLDa
Carbon Credits International, Inc. Executes Agreement for Mobile Based Technology in Retail, Just in Time for the Holidays
PHOENIX, AZ — (Marketwire) — 10/15/12 — Carbon Credits International, Inc. (PINKSHEETS: CARN), doing business as Text A Day, has entered into an Agreement with eLayaway, Inc. (OTCQB: ELAY) to add mobile based technologies to their suite of payment processing solutions. CEO Greg Lambrecht stated, "With the resurgence of layaway, this is a very exciting agreement for Carbon Credits International, Inc. As we head into the holiday season, eLayaway-s use of our Mobile technology will increas
REMINDER: MEDIA ALERT: Kilopass CTO Harry Luan to Present Kilopass Roadmap for Advanced TSMC Processes
Will Exhibit at TSMC Open Innovation Platform Ecosystem Forum
STMicroelectronics : STMicroelectronics Comments on Today-s Speculations
PR No.: C2693C
Industry Accolades Continue for Lattice iCE40 FPGA Family
Ultra-Low Density FPGA Contends for "Digital Semiconductor Product of the Year"
STMicroelectronics: Ericsson and STMicroelectronics Comment on Speculations Regarding ST-Ericsson
C2692C
Smith & Associates Gains ISO/IEC 17025 Accreditation
New Accreditation Confirms the Quality of the Processes and Inspectors in Smith-s Industry-Leading Laboratory Facilities