Digital Lumens Xpress Fixture Named “Best in Class” in Fifth Annual Next Generation Luminaires Competition

Digital Lumens to Be Honored at LEDucation7 Conference in New York City

Digital Lumens to Be Honored at LEDucation7 Conference in New York City

MARIETTA, GA and OTTAWA — (Marketwire) — 03/20/13 — Optical networking specialist today announces a distribution partnership with Goldfield Telecom, a leading distributor of telecom equipment in the U.S. The partnership provides Optelian with another key outlet for the distribution of its optical networking solutions throughout the United States. The Goldfield partnership will focus on targeting and distributing to Independent Operating Companies (IOCs) operating in Tier 3 markets."The

WEST WARWICK, RI — (Marketwire) — 03/19/13 — Astro-Med, Inc. (NASDAQ: ALOT) reports Net Income on a GAAP basis of $7,489,000, equal to $1.00 per diluted share, on sales of $16,186,000, for the Fourth Quarter ended January 31, 2013. For the corresponding period of the previous year, the Company reported Net Income of $854,000 on a GAAP basis, equal to $0.11 per diluted share, on sales of $15,810,000. Net Income in the Fourth Quarter includes the gain on the sale of the Company-s Grass Technol

Shazam, Salesforce.com, Cortexica Use GPUs for Affordable, Scalable Growth in Consumer and Commercial Applications

FREMONT, CA — (Marketwire) — 03/19/13 — DCG Systems, Inc. today announced that it has appointed Ronen Benzion to President of DCG Systems. Ronen will assume the position of President for Dr. Israel Niv, who will continue to serve as Chief Executive Officer. In their respective roles, Mr. Benzion will be expanding products into Inspection and Metrology along with continuing to lead the existing three Product Groups, Field Operations and US Manufacturing Operations, while Dr. Niv will focus on

FD-SOI Technology Among Finalists for Energy Technology Award

Kotura Inks Fab Agreement; Announces Relationships With Mindspeed and BinOptics
NORTH BILLERICA, MA — (Marketwire) — 03/19/13 — has announced that their high-capacity, modular vacuum pump inlet-exhaust traps can be stacked for semiconductor wafer fabrication processes which produce a lot of heavy particulates.The is a robust that can be stacked for 300 mm semiconductor wafer fabricators utilizing LPCVD, PECVD, and ALD processing. Featuring all stainless steel construction with a first stage knock-down baffle, two stacked traps can accumulate up to 2,500 cu. in. of so

SANTA CLARA, CA — (Marketwire) — 03/19/13 — Tensilica®, Inc. today announced that it has joined the HSA (Heterogeneous System Architecture) Foundation, a not-for-profit consortium dedicated to developing architecture specifications that will unlock the performance and power efficiency of parallel computing engines found in many modern devices. Tensilica will contribute its years of experience assisting customers in bringing heterogeneous multicore SoC (system-on-chip) designs to market t

Ecosystem Demo Proves Readiness of Next-Generation 100G PHY and CFP2 Products to Enable 1 Terabit Line Cards